Relocation of Gate Bond Wires on DE-Series Devices (all DE- 150, DE-275, DE-275X2, DE-375 and DE-475 devices)

Relocation of Gate Bond Wires on DE-Series Devices (all DE- 150, DE-275, DE-275X2, DE-375 and DE-475 devices)

An approved assembly subcontractor for IXYS Colorado will change the location of the bond wires from bonding to the device Lead Frame to the device DCB (Direct Copper Bond) substrate. This change will improve the overall reliability of the devices and will be phased in on a lot by lot basis.