The DE-SERIES Fast Power MOSFETs are a new class of unique high-power devices designed as a circuit element from the ground up for high speed, high frequency, high power applications. DEI’s Fast Power TM technology features low insertion inductance (≈2nH), and a low profile low-cost plastic package, with a RthJC as low as 0.08ºC/W, which provides exceptional switching speeds and power handling capabilities.
The DE-SERIES offer 10 times the speed and 3 times the power dissipation, with 1/2 the volume, 1/3 the weight and greatly reduced die stress, of comparable conventional power MOSFET devices.
The DE-SERIES employs the most electrically, mechanically and thermally advanced high-speed device design available today. The combination of silicon die and packaging make the DE-SERIES the device of choice for high power, high-speed applications.
- Isolated Substrate
- high isolation voltage (>2500V)
- excellent thermal transfer
- Increased temperature and power cycling capability
- IXYS advanced low Qg process
- Low gate charge and capacitances
- easier to drive
- faster switching
- Low RDS(ON)
- Very low insertion inductance
- No Beryllium Oxide (BeO) or other hazardous materials
Switching Speed: ≤HF, RF MOSFET devices and ≈5 -10 times faster than conventional MOSFETs.
Frequency: Equal to many HF, RF devices and at least 5-10 times higher than conventional MOSFETs.
High gain: Approximately 3 times higher than HF, RF MOSFET devices.
Power Dissipation: Approximately twice that of HF, RF MOSFET devices and over 3 times higher than conventional MOSFET devices.
High Power Surface mount design: This allows the device to be loaded on to the PCB with all the other components in a high or low power configuration, simplifying mechanical assembly of the system.
Lowered Mechanical Stress: The device floats on the thermal compound such that the mounting hardware will not induce further package stress.
Low Inductance Packaging: The DE-SERIES has the lowest insertion inductance of any equivalent power device.
Economical High Power Mounting: The mounting configuration does not require machining of the PCB or an expensive clamping mechanism.
- Class C, D, and E High Power Generators
- RF Power Amplifiers
- High-Frequency SMPS
- Induction Heating
- Laser Diode Drivers
- High-Speed Pulse Generators