IXYSRF RF Power Modules combine state-of-the-art CMOS gate driver ICs and power RF MOSFETs in single devices to enable more compact and efficient designs along with a reduced parts count. The modules are packaged in IXYSRF’s low-inductance RF package incorporating layout techniques to minimize stray lead inductances for optimum switching performance in a surface-mountable device.
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|Image||Name||Vdss (V)||Id (A)||Rdson (Ω)||Tr (ns)||Tf (ns)||Mode||Package||Datasheet||hf:att:pa_voltage||hf:att:pa_current|