- PCN - Product Change Notice
- PDN - Product Discontinuation Notice
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|Transition to Laser Device Marking PCN-1042017-02||PCN||Manufacturing is moving to laser engraving for device part numbering and any identifying marks that were previously inked for all IXYSRF devices.||October 04, 2017||
|High Capacity Molding PCN-2172017-01||PCN||In order to increase production volume and to reduce product lead times, IXYSRF is introducing higher capacity molds for device packages: DE150, DE275, DE375, DE475 for all MOSFET and Gate Driver part numbers.||February 17, 2017||
|IXRFD631 Manufacturing Directive and Part Number Change to IXRFD631-NRF||PCN||The IXRFD631 is manufactured with material that is not rated for the high temperatures required for a reflow solder process. Therefore these devices are not recommended for use in manufacturing processes using solder reflow. As a part of this PCN, the product part number has been changed to IXRFD631-NFR from IXRFD631.||March 31, 2017||
|Relocation of Gate Bond Wires on DE-Series Devices (all DE- 150, DE-275, DE-275X2, DE-375 and DE-475 devices)||PCN||An approved assembly subcontractor for IXYS Colorado, will change the location of the bond
wires from bonding to the device Lead Frame to the device DCB (Direct Copper Bond)
substrate. This change will improve the overall reliability of the devices, and will be phased in
on a lot by lot basis.
|December 31, 2015||