The isolated SMPD (Surface Mount Power Device) package family offers a power module in a SMD outline with all the advantages of flexibility, automated assembly and reduced package size. With one of the lowest height profiles in the market, it also fulfills the demand for total size reduction and therefore facilitates system cost reduction requirements.
Features
- High Frequency Capable
- Isolated Substrate
- High isolation voltage (>2500V)
- Excellent thermal transfer
- Increased temperature and power cycling capability
- Low gate charge and capacitances
- Easier to drive
- Faster switching
- Low RDS(on)
- Very low insertion inductance (<2nH)
- No beryllium oxide (BeO) or other hazardous materials
Advantages
- Optimized for high speed switching
- Easy to mount—no insulators needed
- High power density
Applications
- Switch and resonant mode DC-DC converters
- Laser drivers
- Pulse generators
- Power amplifiers
